4-Layer High Frequency PCB Built On 8mil RO4003C and FR-4 With Immersion Gold
Signal integrity performance of hybrid PCB improves over the stack-ups with all FR4 board and cost reduces over stack-ups with all low loss material. So this type of mixed material PCB may be of considerable interest to you.
Basic Specifications:
Base Material: 8mil RO4003C + FR4
Copper Weight: 1 oz each layer
Board Thickness: 1.1 mm ±10%
Layer Count: 4 layers
Board Size: 131 x 31 mm =1up
Solder Mask: no solder mask | no silkscreen
Surface Finish: Immersion gold
Via: Through holes
Warpage: ＜0.75%
Net Weight: 0.0113 kg/pcs
Acceptable Standard: IPC-Class-2
Lead time for prototype: 10 working days
Shelf life: 6 months
Stack up, 4 Layer
Contact us today for more preferential price.
Best regards
Ivy Deng | Business development
Bicheng PCB | sales10@bichengpcb.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN
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Bicheng is located at Baoan, Shenzhen, China 518103.
