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Home » » 4 Layer High Frequency PCB Built On 20mil RO4350B With Back Drilling

4 Layer High Frequency PCB Built On 20mil RO4350B With Back Drilling

6-Layer High Frequency PCB Built on 3 Cores of Rogers 20mil RO4003C

 

Hi,

 

PCB built on all low loss material has the notable advantages of less signal transmission loss than other materials. RO4003C has low dielectric constant and good signal transmission and gold surface has good oxidation resistance and good heat dissipation.

 

Basic Specifications:

Base Material:      RO4003C+RO4450F

Copper Weight:   1 oz each layer

Board Thickness: 2.0 mm ±10%

Layer Count: 6 layers

Board Size:   129 x 75 mm = 1up

Solder Mask:       Green solder mask | white silkscreen

Surface Finish:    Immersion gold

Via: Through hole, no Blind via

Warpage:      0.75% warpage

Net Weight:   0.032 kg/pcs

Acceptable Standard:  IPC-Class-2

Lead time for prototype:    12 working days

Shelf life:      6 months

 

Stack up, 6 Layer

Contact us today for more preferential price.

 

Best regards

 

Ivy Deng | Business development

Bicheng PCB | sales10@bichengpcb.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN

If you do not want to receive emails from Bicheng about marketing communications and special offers, reply as "remove" in the subject line.

 

Bicheng is located at Baoan, Shenzhen, China 518103.

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